INCH-POUND
MIL-M-38510/171C
17 February 2004
MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, CMOS, OR GATES, MONOLITHIC SILICON, POSITIVE LOGIC
SUPERSEDING MIL-M-38510/171B
30 April 1984
Reactivated after 17 Feb. 2004 and may be used for new and existing designs and acquisitions.
This specification is approved for use by all Departments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits.
Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA)
are provided and are reflected in the complete Part or Identifying Number (PIN). For this product, the requirements of
MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).
1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein.
1.2.1 Device types. The device types are as follows: Device type Circuit
01 Quad 2-input OR gate
02 Dual 4-input OR gate
03 Triple 3-input OR gate
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style
A |
GDFP5-F14 or CDFP6-F14 |
14 |
Flat pack |
|
C |
GDIP1-T14 or CDIP2-T14 |
14 |
Dual-in-line |
|
D |
GDFP1-F14 or CDFP2-F14 |
14 |
Flat pack |
|
T |
CDFP3-F14 |
14 |
Flat pack |
|
X 1/ |
2/ |
GDFP5-F14 or CDFP6-F14 |
14 |
Flat pack, except A dimension |
equals 0.1" (2.54 mm) max |
||||
Y 1/ |
2/ |
GDFP1-F14 or CDFP2-F14 |
14 |
Flat pack, except A dimension |
equals 0.1" (2.54 mm) max |
1/ As an exception to 3.5.6.2.3 of MIL-M-38510 superceded by MIL-PRF-38535, appendix A, for case outlines X and Y only, the leads of bottom brazed ceramic packages (i.e., configuration 2 of case outlines F-1 or F-2) may have electrodes nickel undercoating which is 50 to 200 microinches (1.27 to 5.08 μm) thick provided the lead finish is hot solder dip (i.e., finish letter A) and provided that, after any lead forming, an additional hot solder dip coating is applied which extends from the outer tip of the lead to no more than 0.015 inch (0.38 mm) from the edge.
2/ For bottom or side brazed packages, case outlines X and Y only, the S1 dimension may go to .000 inch
(.00 mm) minimum.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, 3990 East Broad St., Columbus, OH 43216-5000, or email CMOS@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at www.dodssp.daps.mil.
AMSC N/A FSC 5962
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