MIL-M-38510/152C
1.3 Absolute maximum ratings.
Supply voltage range ................................................................. -0.5 V dc to 7.0 V dc
Input voltage range ..................................................................... -1.5 V dc at -12 mA to 5.5 V dc
Storage temperature range ....................................................... -65°C to 150°C Maximum power dissipation per gate (PD) 1/ :
Device type 01 ...................................................................... 270 mW
Device type 02 ...................................................................... 195 mW Device type 03 ...................................................................... 195 mW
Device type 04 ...................................................................... 140 mW Device type 05 ...................................................................... 190 mW
Device type 06 ...................................................................... 190 mW
Lead temperature (soldering, 10 seconds) ................................. +300°C
Thermal resistance, junction-to-case (eJC):
Cases A, B, C, D, E, F, J, K, and Z ....................................... See MIL-STD-1835
Junction temperature (TJ) .......................................................... +175°C 2/
1.4 Recommended operating conditions.
Supply voltage (VCC) ..................................................................... 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ........................................ 2.0 V dc
Maximum low level input voltage (VIL) ......................................... 0.8 V dc
Normalized fanout (each output) 3/:
At low logic level .................................................................... 10 maximum
At high logic level .................................................................. 20 maximum 4/
Case operating temperature range (TC) ........................................ -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.
1/ Must withstand the added PD due to short circuit test (e.g. IOS).
2/ Maximum junction temperature shall not be exceeded except for short duration burn-in screening conditions per
method 5004 of MIL-STD-883.
3/ The device will fanout in both high and low levels to the specified number of inputs on the same device type as that being tested.
4/ A fanout of 20 normalized loads is provided to facilitate connection of unused inputs to used inputs.
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