MIL-M-38510/148B
1.3 Absolute maximum ratings.
Cathode to anode voltage (device type 01) ...................................... 37 V dc Continuous cathode current range (device type 01) ......................... -100 to +150 mA Reference input current (device type 01) ......................................... -0.05 to 10 mA
Maximum power dissipation (PD) ambient (device type 01) ............. 1,050 mW 1/ Reverse current (device type 02) ..................................................... 20 mA Forward current (device type 02) ..................................................... 10 mA
Storage temperature range .............................................................. -65°C to +150°C Junction operating temperature (TJ) ................................................ +150°C
Lead temperature (soldering, 10 seconds) ....................................... +300°C
1.4 Recommended operating conditions.
Cathode to anode voltage (device type 01) ...................................... 36 V Cathode current (device type 01) ..................................................... 100 mA Reverse current (device type 02) ..................................................... 18 mA Forward current (device type 02) ..................................................... 8 mA
Ambient operating temperature range (TA) ...................................... -55°C to +125°C
1.5 Power and thermal characteristics.
Package |
Case outlines |
Maximum εJC |
Maximum εJA |
8 pin DIP |
P |
38°C/W |
100°C/W |
4 pin can |
x |
80°C/W |
440°C/W |
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/ Derate 8.4 mW/°C above TA = +25°C.
2
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