MIL-HDBK-1331A
4.3 General items to be controlled. The following items should be specified for all microcircuits specified:
a. Storage temperatures (minimum and maximum limits).
b. Lead or case operating temperature extremes (minimum and maximum limits). c. Mechanical outline and dimensions.
d. Terminal designations.
e. Maximum terminal voltage and current (all supplies, inputs, outputs, nodes.)
f. Dynamic electrical parameters (see section 5). g. Static electrical parameters (see section 5).
h. Mechanical and environmental integrity. i. Quality assurance levels and reliability.
j. Packaging and packing.
k. Logic diagram, logic equations and truth table (for digital microcircuits). l. Complex input and output impedance characteristics when applicable.
m. Maximum thermal resistance for the complete microcircuit to the lead or case. n. Maximum power dissipation per function and for the complete microcircuit.
5. ELECTRICAL PARAMETERS TO BE CONTROLLED
5.1 In all specifications or applicable acquisition documents for microcircuits, all applicable electrical parameters of table I, II, and III should be specified together with limits and conditions of measurement, and where indicated, the test methods of MIL-STD-883 should apply. Where "X" appears, the parameter should be specified, but no MIL-STD-883 test methods exists. Where no MIL-STD-883 test methods exist, the manufacturer should use nongovernment standards or commercial documents for guidance.
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