MIL-M-38510/508A
4.3 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted prior to qualification and conformance inspection. The following additional criteria shall apply:
a. Delete the sequence specified in 3.1.9 through 3.1.13 of method 5004 and substitute lines 1 through 5 of table II herein.
b. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
c. Interim and final electrical tests shall be as specified in table II, except interim electrical tests prior to burn in are optional at the discretion of the manufacturer.
d. Post dynamic burn in electrical parameter measurements may, at the manufacturer's option, be performed separately or included in the final electrical parameter measurements.
e. Additional screening for space level product shall be as specified in MIL-PRF-38535.
f. A data retention stress test shall be included as part of the screening procedure and shall consist of the following steps: (Step 1 through 4 are performed at the wafer level.)
(1) Program 100 percent of the total number of cells, excluding the security bit.
(2) Bake, unbiased, for 72 hours at +140°C or for 48 hours at +150°C or for 8 hours at +200°C, or 2 hours at +300°C for unassembled devices only.
(3) Perform margin test using Vm = +5.7 V at +25°C using loose timing (i.e., tACC = 1 µs). (4) Erase.
4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 of table III of MIL-PRF-38535 shall be omitted.
c. Subgroups 4 (CIN and COUT measurements) shall be measured only for the initial qualification and after process or design changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals tested.
d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups 9, 10, and 11.
(1) A sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to programming (see 3.3.2.1). If more than two devices fail to program, the lot shall be rejected. At the manufacturers option, the sample may be increased to 24 total devices with no more than four total device failures allowable.
(2) Ten devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. if more than two devices fail, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 20 total devices with no more than four total device failures allowable.
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