MIL-M-38510/23D
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. This slash sheet has been modified to allow the manufacturer to use alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other
alternative approved by the Qualifying Activity.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagrams and terminal connections. The logic diagram and terminal connections shall be as specified on figure 1.
3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity (DSCC-VA) upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply over the full recommended ambient operating temperature range, unless otherwise specified.
3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535.
3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III.
3.8 Marking. Marking shall be in accordance with MIL-PRF-38535. For class Q product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturer's Quality Management (QM) Plan, the "QD" certification mark shall be used in place of the "QML" or "Q" certification mark.
3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 1 (see MIL-PRF-38535, appendix A).
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