MIL-M-38510-10 Microcircuits, Digital, Bipolar, Ttl, Decoders Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, TTL, microcircuit decoders. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.4.

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MIL-M-38510/10D

1.3  Absolute maximum ratings.

Supply voltage range .............................................................................. -0.5 V dc to +7.0 V dc

Input voltage range ................................................................................. -1.5 V dc at -12 mA to +5.5 V dc

Storage temperature range  .................................................................... -65° to +150°C Maximum power dissipation (PD):  1/

Device types 01, 02 and 03  .............................................................. 226 mW

Device types 04 and 05 .................................................................... 341 mW Device types 06, 07, 08 and 09  ........................................................ 467 mW

Lead temperature (soldering, 10 seconds)  ....................................... +300°C Thermal resistance, junction to case (eJC):

Cases A, B, C, D, E and F ................................................................ (See MIL-STD-1835)

Junction temperature (TJ) 2/ ................................................................... 175°C Maximum current into any output (output off):

Device types 04, 05, 06, 07 and 09  .................................................. 1 mA

1.4  Recommended operating conditions.

Supply voltage (VCC) ............................................................................... 4.5 V dc minimum to 5.5 V dc maximum

Minimum high level input voltage (VIH)  ................................................... 2.0 V dc Maximum low level input voltage (VIL)  .................................................... 0.8 V dc Sink current capability by device type:

Device types 01, 02, 03 .................................................................... 16 mA Device types 04, 05 .......................................................................... 20 mA Device types 06, 07

Outputs A - G ............................................................................. 40 mA BI/RBO node .............................................................................. 8 mA

Device type 08

Outputs A - G ............................................................................. 6.4 mA BI/RBO node .............................................................................. 8 mA

Device type 09 .................................................................................. 10 mA

Case operating temperature range (TC)  ................................................. -55° to +125°C

2.  APPLICABLE DOCUMENTS

2.1  General.  The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples.  While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.

1/  Must withstand the added PD  due to short-circuit test (e.g., IOS).

2/  Maximum junction temperature should not be exceeded except in accordance with allowable short

duration burn-in screening condition in accordance with MIL-PRF-38535.

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