MIL-M-38510-156 Microcircuits, Digital, Ttl, Data Encoders, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, TTL, data encoder, microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.4

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MIL-M-38510/156C

1.3  Absolute maximum ratings.

Supply voltage range   .................................................................   -0.5 V dc to 7.0 V dc

Input voltage range .....................................................................   -1.5 V dc at -12 mA to 5.5 V dc

Storage temperature range   .......................................................   -65°C to 150°C Maximum power dissipation per gate (PD)  1/ :

Device type 01  ......................................................................   385 mW

Device type 02  ......................................................................   330 mW Device type 03  ......................................................................   424 mW

Lead temperature (soldering, 10 seconds) .................................   +300°C

Thermal resistance, junction-to-case (eJC):

Cases E and F  ......................................................................   See MIL-STD-1835

Junction temperature (TJ)  ..........................................................   +175°C   2/

1.4  Recommended operating conditions.

Supply voltage (VCC) .....................................................................   4.5 V dc minimum to 5.5 V dc maximum

Minimum high level input voltage (VIH)   ........................................   2.0 V dc

Maximum low level input voltage (VIL)   .........................................   0.8 V dc

Case operating temperature range (TC) ........................................   -55°C to +125°C

2.  APPLICABLE DOCUMENTS

2.1  General.  The documents listed in this section are specified in sections 3, 4, or 5 of this specification.  This section does not include documents cited in other sections of this specification or recommended for additional information or as examples.  While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.

2.2  Government documents.

2.2.1  Specifications and Standards.  The following specifications and standards form a part of this specification to the extent specified herein.  Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-38535     -   Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883      -   Test Method Standard for Microelectronics.

MIL-STD-1835    -   Interface Standard Electronic Component Case Outlines.

(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA  19111-5094.

1/    Must withstand the added PD  due to short circuit test (e.g. IOS).

2/    Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening

conditions per  method 5004 of MIL-STD-883.

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