INCH-POUND MIL-M-38510/59D
24 February 2006
MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, CMOS, DECODER,
MONOLITHIC SILICON, POSITIVE LOGIC
SUPERSEDING MIL-M-38510/59C
30 April 1984
Reactivated after 24 Feb. 2006 and may be used for new and existing designs and acquisitions.
This specification is approved for use by all Departments and Agencies of the Department of Defense.
The requirements for acquiring the product herein consists of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits.
Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA) are provided and are reflected in the complete Part or Identifying Number (PIN). For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).
1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type Circuit
01 BCD-to-decimal decoder
51 BCD-to-decimal decoder
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style
E |
GDIP1-T16 or CDIP2-T16 |
16 |
Dual-in-line |
F |
GDFP2-F16 or CDFP3-F16 |
16 |
Flat pack |
N |
CDFP4-F16 |
16 |
Flat pack |
Z 1/ 2/ |
GDFP2-F16 or CDFP3-F16 |
16 |
Flat pack, except A dimension |
equals 0.100" (2.54 mm) max |
1.3 Absolute maximum ratings.
Supply voltage range (VDD - VSS):
Device type 01................................................................................. -0.5 V dc to +15.5 V dc
Device type 51................................................................................. -0.5 V dc to +18.0 V dc
Input current (IIN) (each input) ........................................................... ±10 mA
Input voltage range (VIN).................................................................... (VSS - 0.5 V) ≤ VI ≤ (VDD + 0.5 V)
Storage temperature range (TSTG).................................................... -65° to +175°C
Maximum power dissipation (PD) ...................................................... 200 mW
Lead temperature (soldering, 10 seconds) ....................................... +300°C
Thermal resistance, junction to case (eJC)......................................... See MIL-STD-1835
Junction temperature (TJ).................................................................. 175°C
1/ As an exception to nickel plate or undercoating paragraph of MIL-PRF-38535, appendix A, for case outline Z only, the leads of bottom brazed ceramic packages (i.e., configuration 2 of case outline F) may have electroless nickel undercoating which is 50 to 200 microinches (1.27 to 5.08 µm) thick provided the lead finish is hot solder dip (i.e., finish letter A) and provided that, after any lead forming, an additional hot solder dip coating is applied which extends from the outer tip of the lead to no more than 0.015 inch (0.38 mm) from the package edge.
2/ For bottom or side brazed packages, case outline Z only, the S1 dimension may go to .000 inch
(.00 mm) minimum.
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or email to CMOS@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.daps.dla.mil.
AMSC N/A FSC 5962
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