MIL-M-38510-555 Microcircuits, Digital, Cmos, Remote Terminal Interface, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, CMOS, remote terminal interface RTI microcircuits. One product assurance class class B and a choice of case outlines, and lead finishes are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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INCH-POUND

MIL-M-38510/555B

07 August 2006

MILITARY SPECIFICATION

SUPERSEDING MIL-M-38510/555A

20 March 1991

MICROCIRCUITS, DIGITAL, CMOS, REMOTE TERMINAL INTERFACE, MONOLITHIC SILICON

Reactivated after 07 August 2006 and may be used for new and existing designs and acquisitions.

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein consists of this specification sheet and MIL-PRF 38535.

1.  SCOPE

1.1  Scope.  This specification covers the detail requirements for monolithic silicon, CMOS, remote terminal interface (RTI) microcircuits.  One product assurance class (class B) and a choice of case outlines, and lead finishes are provided and are reflected in the complete Part or Identifying Number (PIN).  For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).

1.2  Part or identifying number (PIN).  The PIN is in accordance with MIL-PRF-38535 and as specified herein.

1.2.1  Device types.  The device types are as follows:

Device type                                                                           Circuit

01                                                  Remote terminal interface (clock duty cycle logical high

10 percent to 35 percent).

02                                                  Remote terminal interface (clock duty cycle logical high

40 percent to 60 percent).

1.2.2  Device class.  The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3  Case outlines.  The case outlines are as designated in MIL-STD-1835 and as follows:

1.3  Absolute maximum ratings.

Supply voltage range (VDD  - VSS)....................................................... -0.3 V dc to +7.0 V dc Input/output voltage range ................................................................ -0.3 V dc to (VDD  + 0.3 V) Storage temperature range  (TSTG).................................................... -65° to +150°C

Case operating temperature range (TC)  ........................................... -55°C to +125°C Maximum junction temperature (TJ)  1/ ............................................. 175°C

Thermal resistance, junction-to-case (eJC)......................................... See MIL-STD-1835

Maximum power dissipation (PD) ...................................................... 300 mW

1/  Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with MIL-PRF-38535.

Comments, suggestions, or questions on this document should be addressed to:  Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or email to MICROPROCESSOR@dscc.dla.mil.  Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.daps.dla.mil.

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