MIL-M-38510-245 Microcircuits, Digital, Cmos, 4096 Bit, Static Random Access Memory Sram, Bulk Silicon And Silicon On SapphireThis specification covers the detail requirements for bulk silicon and silicon on sapphire SOS, static, 4096 bit, random access memory microcircuits. Two product assurance classes, four radiation hardness assurance levels, and a choice of case outlines and lead finishes are provided and are reflected in the part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.4

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41 - 42 - 43 - 44 - 45 - 46 - 47 - 48 - 49 - 50 - 51 - 52 - 53 - 54 - 55 - 56 - 57 - 58 - 59 - 60 - 61 - 62 - 63 - 64 - 65 - 66 - 67 - 68 - 69 - 70 - 71 - 72 - 73 - 74 - 75 - 76 - 77 - 78

MILITARY SPECIFICATION

INCH-POUND MIL-M-38510/245B

13 March 2006

SUPERSEDING MIL-M-38510/245A

28 January 1987

MICROCIRCUITS, DIGITAL, CMOS, 4096 BIT, STATIC RANDOM ACCESS MEMORY (SRAM), BULK SILICON AND SILICON ON SAPPHIRE

Inactive for new design after 24 July 1995

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535

1. SCOPE

1.1 Scope. This specification covers the detail requirements for bulk silicon and silicon on sapphire (SOS), static, 4096 bit, random access memory microcircuits. Two product assurance classes, four radiation hardness assurance levels, and a choice of case outlines and lead finishes are provided and are reflected in the part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4).

1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device types. The device types are as follows:

Device type	Circuit	Access times
01 (bulk silicon)	4096x1 bit RAM	120 ns
02 (bulk silicon)	1024x4 bit RAM	120 ns
03 (synchronous; bulk silicon)	4096x1 bit RAM	320 ns
04 (synchronous; bulk silicon)	1024x4 bit RAM	320 ns
05 (asynchronous; SOS)	4096x1 bit RAM	250 ns
06 (asynchronous; SOS)	1024x4 bit RAM	250 ns

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style

v	GDIP1-T18 or CDIP2-T18	18	Dual-in-line
K	GDFP2-F24 or CDFP3-F24	24	Flat pack

1.2.4 Radiation hardness level. Radiation hardness levels shall be as defined in MIL-PRF-38535.

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-vAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to memory@dscc.dla.mil . Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.daps.dla.mil

AMSC N/A FSC 5962